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Office Bearers

Mr. Wu Bingshu
Chairman
China Die & Mould Industry Association [CDMIA]
Room 506, Building 4, No.20, Shouti South Road, Beijing China
Tel: +86-10 88356462
Fax: +86-10 88356461
E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
Website: www.cdmia.com.cn

Mr. TOSHIKIYO MAKINO
Vice Chairman
Japan Die & Mold Industry Association [JDMIA]
33-12,YUSHIMA,2-CHOME.BUNKYO-KU,TOKYO,113-0034, Japan
Tel: +82-03-58165199
Fax: +82-03-58165913
E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
Website: www.jdmia.or.jp.org




Mr. Park Soon-Hwang
Secretary (Vice Chairman Status)
Korea Die & Mold Industry Cooperative [KODMIC]
KODMIC B/D, 287-2, Doksan-dong, Geumchon-gu, Seoul, Korea
Tel: +82-2 783-1711
Fax: +82-2 784-5937
E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
Website: www.koreamold.com


Mr. Cheng Peng Heok
TREASURER
Malaysian Mould and Die Association [MMADA]
21-3, Jalan 1/116B, Kuchai Entrepreneurs Park, Off Jalan Kuchai Lama, 58200 Kuala Lumpur, Malaysia
Tel: +603 7980 1415 / 603-7983 6241
Fax: +603) 7980 1442
E-mail: This e-mail address is being protected from spambots. You need JavaScript enabled to view it
Website: www.mmada.org.my

 

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